4. SPECIFY PACKAGE CONFIGURATION
The target shapes and size of the bundle should be established early at the same time since it is the foundation where lots of other decisions will certainly be made. In addition to shapes and size, optimum locations for parts (e.g., I/O ports, switches and also control devices for product efficiency, assembly convenience, functionality, convenience of accessibility for rework or repair service) ought to be thought about.
A mock-up of the product box is necessary to set out the flex PCB, which promotes the conversion of the 3-dimensional bundle need to the 2-dimensional format required for PCB manufacturing process. A paper doll mock-up of the flexibles circuits can also be useful.
5. SPECIFY MECHANICAL REQUIREMENTS
It is required to consider the mechanical requirements that will be placed on the flex PCB. For example, will the application be static, needing flex to install? Or will the application require energetic flexing? If the application requires dynamic flexing, will it call for continuous or intermittent operation? Needs for vibrant bending vary because an application could require anywhere from numerous cycles annually to numerous cycles each min. The construction, design layout issues (such as the assurance that no vias will certainly be found in bend locations) and also material choices will be affected by the response to these inquiries.
6. SPECIFY ELECTRICAL REQUIREMENTS
Like electronic item, it is needed to identify just what the essential electrical requirements will certainly be as early as feasible. For example, just what are the power requirements? Just how much current is needed? At what voltage? Just what is the anticipated maxi- mum or height current? Is EMI a problem and exists a need for securing? If the flexible circuits is large, is voltage decrease a concern? Prevail electrical parasitic effects, such as capacitance and also inductance, vital to the efficiency for the design or application? Each of these considerations could potentially impact product selection and/or circuit design/layout strategy.
Focus needs to be given to prospective conflicts of purpose in design. In some cases, the digital needs of the item are at cross-purposes with mechanical demands. For example, there might be a wish to dynamically flex a microstrip construction, which is not recommended from a mechanical viewpoint. Conflicts of function have to be recognized early as well as solved prior to the design is devoted to manufacture.
7. IDENTIFY COMPONENT LOCATIONS
As a whole, parts, connectors, buttons and various other tools should hinge on enhanced areas such as supports, while locations that are to be stretched or curved need to have no elements put on them. Exemptions are feasible, but it is not a preferred practice. Additionally, parts need to never be put in or near locations that are to be actively stretched.