BACK BARED FLEXIBLE CIRCUITS

Back exposed, likewise called double side access, dual access or rear end gain access to, flexible circuits are most generally solitary conductor layer circuits that have their metal conductors accessed or accessible from both sides. The back access technique is typically used when part soldering or one more interconnection approach is called for on two sides of the flex PCB. This circuit design and manufacture approach preempts the requirement for plated through-holes and also the additional actions that the plated through-hole process entails.

There are several methods for creating a back bared, single conductor layer circuit. The following are some of the much more frequently made use of techniques.

PRE-PUNCHED BASE FILM LAMINATION

Pre-punched base movie lamination is the most usual method for producing back exposed circuits, mostly because the method supplies the very best usage of generally readily available modern technology. This manufacturing technique is typically utilized in the manufacture of TAB tape and flexible circuit interposers for IC packaging.

The technique entails pre-drilling and/or punching access holes in the flexible laminate film prior to the movie is laminated flooring to the metal foil that is consequently engraved to produce the circuit paths. A top coverlayer with openings over various other discontinuation locations is then laminated to the etched circuit. Openings in the metal foil can be produced by exploration, punching or by engraving throughout the exact same etching process used to develop the circuit pattern. In the last of these instances, it is feasible to produce oddshaped holes such as rectangular shapes or crosshairs that could boost the solder joint formation.

CHEMICAL ETCHING OF POLYIMIDE

This approach is specifically for usage with flexible circuits made making use of polyimide films. Polyimide films, while usually a chemically unreactive substratum, undergo dissolution in warm strongly alkaline remedies. The method involves masking the circuit with a suitable metallic or natural stand up to picture and also engaging the circuit in a warm caustic option to liquify the polyimide in the preferred areas. Typically this is done with a series of etch and also rinse steps.

MECHANICAL SKIVING

Mechanical skiving is an additional technique of accessing functions from both sides of a single metal layer flex PCB. It is not commonly used due to the broad availability of laser ablation both in-house as well as with outdoors companies. The method includes mechanically getting rid of polymer film from the top (or bottom) of the circuit attribute on a single-sided flex PCB in order to reveal it for affiliation or test. Techniques have consisted of everything from careful manual scratching with a sharp tool to making use of a fiberglass rod, filed to a factor of the correct size, as a rotating abrasion tool in a drill press.

An additional skiving approach made use of for some applications in the past is end-mill machining. Here a flat-faced, fluted-end mill little bit of the proper dimension is chucked in a drill press as well as used to very carefully remove the covering film subjecting the base metal function. Mechanical skiving is not one of the most economical means to double gain access to a flex PCB design for quantity production, yet it can be a reliable strategy for small quantity prototypes or design adjustment orders.