Provided the passing up description of the fundamental multilayer process the visitor ought to have the ability to appreciate some of the variations that are possible for making multilayer flex PCB.

CONSECUTIVE LAMINATION PROCESSING
In consecutive lamination manufacture, the conductor layers are separately made as well as the resulting substructures are laminated with each other layer-by-layer (or substructure-bysubstructure) till the multilayer affiliation structure is complete. The panel is after that pierced as well as the holes plated through making connection to the different layers. The process can be taxing, but does enable some distinct design flexibility. On the negative side, such building and constructions require near-perfect yield at every process step or they could cause an inadequate ultimate return. Consecutive lamination handling has actually been utilized with some success by particular Japanese makes to develop stiff multilayer flex PCB circuits for cell phones and so forth.

A variant on this approach, defined briefly earlier, permits the electrical interconnections between layers to be made throughout the lamination procedure itself. The process is a cross between procedures used to produce ceramic crossbreed frameworks and those made use of to develop anisotropically interconnected multilayer flex PCB

PLATED POST INTERCONNECT (SEQUENTIAL) MULTILAYERS FLEX PCB.
Plated article adjoin multilayer flex PCB are made by a non-standard manufacturing process that is similar to the processes preferred by produces that create multichip components (MCM). With this method, the flex PCB circuit layers are interconnected making use of solid plated steel articles that go through from layer to layer. The articles may continually pile in addition to themselves or could be moved aside making link to simply one other layer. This modern technology ideal serves multilayer flex PCB buildings that need to be bound to an enhancing base. The following is a short summary of the process:

– Specially prepared substrate is coated with a flex PCB film.
– Holes are opened to give adjoin factors in the completed product.
– Surface is metallized, imaged and plated up with the suitable circuit pattern.
– Surface is recoated with a flex PCB film layer.
– Holes are generated in the film.
– Surface is metallized and also imaged, this time around with just the interconnects or blog posts formed on the board.
– Posts are layered to density.
– Resist mask is stripped off.
– Micro-thin surface metallization is etched away.
– Surface could be planarized at this time.
– Another layer of dielectric movie is laid down.
– The cycle starts anew as well as proceeds up until all layers are processed.
– The circuit is finally separated from its base when complete.

This method enables extremely thick structures to be produced, however there are few flex PCB suppliers capable of creating this kind of product currently. Like the consecutive lamination process, near excellent yields are required at each handling action to get acceptable final yields.