LOW MOISTURE ABSORPTION
Wetness absorption is certainly not desirable for any type of flexible circuits substrate, or any stiff substratum for that matter. Dampness can negatively affect the manufacturing procedure by causing delamination in process and also assembly and also deteriorating the efficiency of the finished item by altering the product’s dielectric constant and increasing signal loss. Moisture in the atmosphere varies substantially in the different parts of the globe where flexible circuits are made. Controlling moisture can be pricey and also tough, so it is best to understand the facets of the materials being used as well as just how processes or layouts can accommodate prospective variation.
CHEMICAL RESISTANCE
Depending on the application, a flexible circuit sproduct’s ability to resist a varix of different chemicals is essential to both the end and also the manufacturer user. For the manufacturer, the many various corrosive chemistries made use of in flexible circuits fabrication cause issues concerning exactly how well the product will stand up to handling. The product must work with a large range of process chemistries and also common solvents made use of in assembly and also cleansing procedures.
Due to worker safety and security as well as environmental concerns, lots of procedure chemistries and materials have been removed from use as well as changed by more recent materials. Etch stands up to are currently eliminated by caustic liquid remedies that are more secure compared to earlier chemistries such as methylene chloride and also methyl ethyl ketone (MEK) which were commonly made use of at one time for cleaning circuits. Currently, more benign solvents or eco-friendly cleaners are being introduced as well as the compatibility of their chemistries need to be comprehended when it come to flexible circuits products. Various other approaches, such as plasma cleansing and also various other non solvent type cleansing treatments, have actually been advertised as ways to tidy adhesive from pad areas without exposing circuits to harmful solvents as well as handling chemical adsorption problems. Chemical resistance in end usage may currently be even more of an issue when choosing a sticky, coverfilm or covercoat. An archetype is ink jet cartridges or ink printing systems where the ink could remain in a caustic solution that might attack and/or swell any kind of exposed adhesive triggering troubles in final result performance.
LOT-TO-LOT CONSISTENCY
Variation is the bane of manufacturing, so gear uniformity is important to good procedure control. While Six Sigma top quality targets might never truly be obtained in manufacture, extreme uniformity of physical, mechanical and also electrical material properties is essential. A high level of consistency will supply assurance that the gear will execute well both in manufacturing as well as in the field.
When it come to handling dimensional stability, circuit producers could change artwork or tooling for a conventional known shrinkage, yet making changes from great deal to lot is not a feasible option, particularly taking into consideration the expenses of tough tooling. When mass production is in restaurant, flex product whole lot screening and pre-selection for production to match art work and also tooling are cost-prohibitive operating treatments, especially as products are getting smaller sized as well as smaller sized. Positionings over bigger locations are essential to make systems more economical as well as less labor intensive. Layup of specific coverfilm items can be carried out if necessary to attend to the issue; nevertheless, the layup of a single 12″ x 18″ sheet is much more affordable.